by Bianca Jaeck | Sep 27, 2019 | Press releases
Spherolyte® Cu UF3 – Cu RDL process for microvia filling and fine line plating Berlin, September 27, 2019: Atotech, a world-wide leader in the field of chemicals and equipment for printed circuit board and package substrate manufacturing, will present at the...
by Bianca Jaeck | Sep 23, 2019 | Press releases
Polygon® PLB Line® – Atotech’s new desmear and electroless copper line for excellent blind micro via filling capability enabling high reliable multilayer, rigid-flex and HDI PCB production Berlin, September 23, 2019: Atotech, a worldwide leader in providing...
by Bianca Jaeck | Sep 20, 2019 | Press releases
InPro® RA – copper crystal structure Berlin, September 20, 2019: Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global...
by Bianca Jaeck | Sep 16, 2019 | Press releases
Spherolyte® Cu UF3 – Electrolytic Cu process for RDL, fine-line RDL, RDL+ VIA, Pillar Berlin, September 16, 2019: Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual...
by Katharina Stier | Sep 11, 2019 | Tradeshows and events
Atotech will present its solutions for motorsport at the AIMExpo booth 919. Join us to learn more about product highlights for brakes, exhaust systems, shock absorbers, wheels and many more motorcycle parts that require the highest quality product features. Atotech...
Recent Comments