by Bianca Jaeck | Sep 23, 2019 | Press releases
Polygon® PLB Line® – Atotech’s new desmear and electroless copper line for excellent blind micro via filling capability enabling high reliable multilayer, rigid-flex and HDI PCB production Berlin, September 23, 2019: Atotech, a worldwide leader in providing...
by Bianca Jaeck | Sep 20, 2019 | Press releases
InPro® RA – copper crystal structure Berlin, September 20, 2019: Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global...
by Bianca Jaeck | Sep 16, 2019 | Press releases
Spherolyte® Cu UF3 – Electrolytic Cu process for RDL, fine-line RDL, RDL+ VIA, Pillar Berlin, September 16, 2019: Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual...
by Bianca Jaeck | Aug 5, 2019 | Press releases
Berlin, Germany, August 5th, 2019:Deal expands Atotech’s product portfolioAtotech today announced that it has acquired J-KEM International (“J-KEM”), based in Rosersberg, Sweden. J-KEM is a global supplier of high-quality chemical products and processes for the...
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