by Markus Lehr | May 17, 2018 | Press releases
Berlin, 17 May, 2018: Atotech B.V. (“Atotech”) announced today that its indirect parent company and the direct parent company of Alpha 3 B.V., Alpha 2 B.V. (the “Holdco Issuer”), intends to offer U.S. dollar-denominated, 5-year, senior unsecured PIK toggle notes in an...
by Markus Lehr | May 16, 2018 | Tradeshows and events
Spherolyte® Cu UF3: Micro via filling post anneal Berlin, 17 May, 2018: Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth,...
by Markus Lehr | May 15, 2018 | Press releases
InPro® THF: Current density: 3.0 A/dm², dimple < 3μm [/et_pb_text][/et_pb_column][et_pb_column type="2_3"][et_pb_text admin_label="New products for advanced HDI and flex/ flex-rigid PCBs at C’Tex 2018" text_font_size="18" border_style="solid" _builder_version="3.2.2"]...
by Markus Lehr | Apr 24, 2018 | Press releases
Etching effect with BondFilm® HF Berlin, 25 April, 2018: BondFilm® HF is Atotech’s new process for the treatment of inner layer cores. It leads to highest bonding performance in the manufacture of multilayer & HDI printed circuit boards. This innovative new...
by Markus Lehr | Apr 23, 2018 | Tradeshows and events
Printoganth® RA: Blister-free electroless copper deposition after acid copper plating InPro® SAP3: Improved distribution at higher current densities Berlin, 23 April, 2018: At KPCA Show 2018, held in Gyeonggi-do from April 24 to 26, Atotech will showcase its latest...
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