by Markus Lehr | Sep 1, 2017 | Press releases
Neoganth® X Activator vs Neoganth® U Activator: Coverage performance comparison on three different base materials Berlin, 1 September, 2017: A major cost driver for PCB manufacturers with horizontal plating lines is the palladium consumed within the activation step....
by Markus Lehr | Aug 25, 2017 | Press releases
SEM result: Impact of bad conditions prior to Pd-initiation on the surface morphology Berlin, 25. August, 2017: Atotech, a world-wide leader in the field of chemicals and equipment for printed circuit board and package substrate manufacturing, will present its latest...
by Markus Lehr | Jul 5, 2017 | Press releases
Process flow for BondFilm® LDD MSAP + LDD MSAP Enhancer Berlin, 6 July, 2017: Atotech introduces BondFilm® LDD and BondFilm® LDD Enhancer, its latest additions to the BondFilm® product family, the worlds most successful, reliable and omnipresent oxide replacement...
by Markus Lehr | Jun 2, 2017 | Tradeshows and events
Surface roughness after treatment with NovaBond® IT Atotech presents NovaBond® IT at the JPCA Show 2017 BERLIN, 2 June, 2017: Atotech will introduce NovaBond® IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application...
by Markus Lehr | May 18, 2017 | Press releases
Requirements, trends and solutions More than 160 guests from across Europe participated in Atotech’s Corrosion Protection Conference held in Milan, May 11-12, 2017 Berlin, May 2017: On May 11-12, 2017, Atotech was joined by representatives and influential decision...
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