by Markus Lehr | Oct 22, 2018 | Press releases
Showing Atotech’s Inpulse® 2THF process performing “X-plating and BMV filling” to realize a uniform bridge plating and through hole filling – a patented plating technology by Atotech Atotech, a leading provider of chemicals and equipment for PCB, package...
by Markus Lehr | Oct 12, 2018 | Press releases
Rick Nichols, Global Product Manager Surface Finishing Rick Nichols, Global Product Manager Surface Finishing at Atotech Group, is invited to the Surface Finish Expert Panel at this year’s SMTA conference 2018 held from October 14 to 18, 2018, at the Donald Stephenson...
by Markus Lehr | Oct 8, 2018 | Press releases
MultiPlate® PLP, Atotech’s revolutionary new tool for FO-PLP Berlin, 8 October, 2018: “Upscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost” will be the topic of Atotech’s presentation at this year’s iMAPS conference, held in...
by Markus Lehr | Sep 3, 2018 | Press releases
Printoganth® RA – Shiny surface appearance after electrolytic copper plating moderated growth of copper crystals Berlin, 3 September, 2018: Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless...
by Katharina Stier | Aug 29, 2018 | Press releases
Formation of a 3D fillet on the flank of a QFN; Source: Micronas, Freiburg, Germany Berlin, 29 August, 2018: Atotech today announced that it will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018 with a booth (booth no....
by Markus Lehr | Jul 24, 2018 | Press releases
柏林,2018年7月20日: 安美特成立于1993年,已成为表面处理行业中全球最可靠、最具创新力和领先的整体解决方案供应商之一。在过去的一年中,我们已经转变为一家独立的公司,并刚刚完成了全公司的架构重组,以提高客户服务水平。它通过在技术最先进的细分市场中为产品组合添加新产品,扩展了其技术产品。作为一个创新的领导者,在这个公司历史新里程之后,也是时候设计一个新的公司标识,充分代表安美特品牌对外界的影响。 首席执行官Geoff...
Recent Comments