by Markus Lehr | Jun 14, 2018 | Press releases
Excellent throwing power: Board thickness: 0.3mm, Hole: 0.15mm, CD: 2.8ASD, Line speed: 0.6m/min, Flow rate: 15HZ, Average TP% : 120% Berlin, 14 June, 2018: The flex/ flex-rigid PCB market continues to grow as more and more designs call for flexible inner layers with...
by Katharina Stier | May 31, 2018 | Press releases
Image of a rigid-flex PCB BERLIN, May 31, 2018: Atotech today announced that it will present its latest production solutions for the flex/ flex-rigid PCB market at the New Product Introduction (NPI) sessions at the JPCA 2018 show. The trade show will be held from June...
by Katharina Stier | May 29, 2018 | Press releases
BERLIN, May 29, 2018: Atotech today announced that it will partake in the IPC Automotive Electronics Reliability Forum with a presentation on “Dissipating Thermal Energy in PCBs – Solid Copper Through Via Filling”. The forum will be held from June 4 to 5, 2018,...
by Katharina Stier | May 24, 2018 | Press releases
Fig.1: Electroless nickel aluminum connector parts BERLIN, May 2018: Aluminum is a very reactive metal and has a tendency to form an oxide layer very rapidly when in contact with oxygen. The presence of the oxide layer is not desirable in cases where the surface has...
by Markus Lehr | May 17, 2018 | Press releases
Berlin, 17 May, 2018: Atotech B.V. (“Atotech”) announced today that its indirect parent company and the direct parent company of Alpha 3 B.V., Alpha 2 B.V. (the “Holdco Issuer”), intends to offer U.S. dollar-denominated, 5-year, senior unsecured PIK toggle notes in an...
by Markus Lehr | May 15, 2018 | Press releases
InPro® THF: Current density: 3.0 A/dm², dimple < 3μm [/et_pb_text][/et_pb_column][et_pb_column type="2_3"][et_pb_text admin_label="New products for advanced HDI and flex/ flex-rigid PCBs at C’Tex 2018" text_font_size="18" border_style="solid" _builder_version="3.2.2"]...
Recent Comments