News archive
Press releases
![Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics](https://www.atotech.com/wp-content/uploads/2019/03/printoganth-t1-prev.jpg)
Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics
Atotech to present a new high-throw e’less Cu bath, through-hole, BMV filling, and conformal plating electrolyte, and its revolutionary ENIG final finish at the IPC APEX Expo 2019.
![A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics](https://www.atotech.com/wp-content/uploads/2019/03/nepcon-japan-teaser.jpg)
A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics
Atotech to present its new series of panel level plating processes and equipment for high resolution pattern plating during NEPCON Japan 2019.
![Atotech at the Electronics Packaging Technology Conference 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/11/SEM-micrographs-of-copper-structure-prev.jpg)
Atotech at the Electronics Packaging Technology Conference 2018 || Electronics
Atotech will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.
![Atotech to present at SEMICON Europa and electronica 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/11/Plating-fine-lines-Cu-pads-prev.jpg)
Atotech to present at SEMICON Europa and electronica 2018 || Electronics
Atotech’s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements.
![Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/10/Bridge_Plating_N-Inpulse2THF-prev.jpg)
Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018 || Electronics
Atotech will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook”.
![Atotech’s Surface Finish specialist Rick Nichols at this year’s SMTA International 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/10/Rick-Nichols-at-SMTA-International-2018.jpg)
Atotech’s Surface Finish specialist Rick Nichols at this year’s SMTA International 2018 || Electronics
Atotech invites all conference visitors to join the talks and meet Rick Nichols to discuss these and other current product highlights.
![Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP) || Electronics](https://www.atotech.com/wp-content/uploads/2018/10/MultiPlate-PLP-prev.jpg)
Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP) || Electronics
Atotech specialists will speak at the iMAPS on several current topics such as recent developments and solutions for Panel-Level Packaging.
![The next revolution in electroless copper for advanced FPCB || Electronics](https://www.atotech.com/wp-content/uploads/2018/09/Printoganth-RA-prev-.jpg)
The next revolution in electroless copper for advanced FPCB || Electronics
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.
![Products for a SMART world – Atotech to present and exhibit at the 38th IEMT conference || Electronics](https://www.atotech.com/wp-content/uploads/2018/08/IEMT-Pic-YF-3.jpg)
Products for a SMART world – Atotech to present and exhibit at the 38th IEMT conference || Electronics
Atotech today announced that it will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018.
![安美特的未来继续迈向新高峰 一家充满活力的公司迎来新标识 || Corporate](https://www.atotech.com/wp-content/uploads/2018/07/Atotech_Logo_ver_RGB-1080x675.jpg)
安美特的未来继续迈向新高峰
一家充满活力的公司迎来新标识 || Corporate
Leading company for plating chemicals, equipment and services, Atotech, launches its new logo.
Tradeshows and events
![productronica and Semicon Europa 2017 || Munich, Germany](https://www.atotech.com/wp-content/uploads/2017/10/productronica-2017-prev.jpg)
productronica and Semicon Europa 2017 || Munich, Germany
Atotech presents next generation technologies for smart phones, aerospace and automotive at the productronica and Semicon Europa 2017 in Munich.
![TPCA 2017 || Taipei, Taiwan](https://www.atotech.com/wp-content/uploads/2017/10/tpca-2017-prev.jpg)
TPCA 2017 || Taipei, Taiwan
Atotech presents next generation HDI technologies using (advanced) modified semi-additive processing (amSAP/mSAP) for smartphone applications at the TPCA Show 2017 in Taipei.
![Pro SF 2017 || Shanghai, China](https://www.atotech.com/wp-content/uploads/2017/09/Pro-SF-2017-prev.jpg)
Pro SF 2017 || Shanghai, China
Atotech will be participating in the International Surface Finishing Exhibition 2017, presenting most innovative solutions.
![SAE Brake Colloquium & Exhibition || Orlando, USA](https://www.atotech.com/wp-content/uploads/2016/02/Zinni-220-e1528266722250.jpg)
SAE Brake Colloquium & Exhibition || Orlando, USA
For years, the SAE Brake Colloquium has been the perfect place to obtain the most critical and up-to-date information on braking and brake systems for OE/aftermarket customers and end users.
![ZVO Oberflächentage 2017 || Berlin, Germany](https://www.atotech.com/wp-content/uploads/2017/09/Logo.jpg)
ZVO Oberflächentage 2017 || Berlin, Germany
From September 13 – 15, the ZVO congress (ZVO Oberflächentage) is taking place in the German capital Berlin. Atotech is a proud sponsor of the event and will be present with a booth.
![Automotive Manufacturing 2017 || Bangkok, Thailand](https://www.atotech.com/wp-content/uploads/2017/06/Thailand-automotive-manufacturing.jpg)
Automotive Manufacturing 2017 || Bangkok, Thailand
From June 21 – 24, 2017, Atotech presents next generation surface finishing technologies for decorative and functional applications at the Automotive Manufacturing 2017 in Bangkok.
![SURFIN || Atlanta, USA](https://www.atotech.com/wp-content/uploads/2017/06/Surfin.jpg)
SURFIN || Atlanta, USA
Atotech looks forward to this year’s SUR/FIN. Our SURface FINishing experts. will introduce you to the latest state-of-the-art technologies, and discuss current and upcoming market requirements, as well as technology trends.
![Fastener Fair Mexico 2017 || Mexico City, Mexico](https://www.atotech.com/wp-content/uploads/2017/03/Fasteners-coating.jpg)
Fastener Fair Mexico 2017 || Mexico City, Mexico
Next week, this year’s Fastener Fair Mexico – the only fastener and fixing event for Latin America – opens its doors in Mexico City. We are pleased to present our most innovative and sustainable coating solutions.
![JPCA Show 2017 || Tokyo, Japan](https://www.atotech.com/wp-content/uploads/2017/06/NovaBondIT_PM_2-prev.jpg)
JPCA Show 2017 || Tokyo, Japan
Atotech will introduce NovaBond® IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding and soldermask pretreatment, to press and media at this year’s JPCA Show Press Forum.
![C-Tex 华东电路板暨表面贴装展览会 || 中国苏州](https://www.atotech.com/wp-content/uploads/2017/05/CTEX_2017_Booth_Front-prev.jpg)
C-Tex 华东电路板暨表面贴装展览会 || 中国苏州
安美特展示了新一代先进HDI湿流程及系统方案