News archive
Press releases
![Cupracid® Flex and InPro® Flex: Advanced copper plating processes for Flex-PCBs || Electronics](https://www.atotech.com/wp-content/uploads/2018/06/CupracidFlex_InProFlex-prev.jpg)
Cupracid® Flex and InPro® Flex: Advanced copper plating processes for Flex-PCBs || Electronics
Atotech has developed two new acid copper processes – InPro® Flex and Cupracid® Flex – to serve the flexible printed circuit board market and support its customers to overcome the current technical barriers in FPCB manufacturing.
![Atotech to present its new product series for flex/ flex-rigid printed circuit board (PCB) manufacturing at JPCA 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/04/Flex-flex-rigid_pcb-pre-e1527671966582.jpg)
Atotech to present its new product series for flex/ flex-rigid printed circuit board (PCB) manufacturing at JPCA 2018 || Electronics
The trade show will be held from June 6 to 8, 2018, at Tokyo Big Sight, East Exhibition Halls 4 to 8, in Tokyo, Japan.
![Dissipating Thermal Energy in PCBs – Atotech to participate in the IPC Automotive Electronics Reliability Forum || Electronics](https://www.atotech.com/wp-content/uploads/2018/05/automotive-preview-e1527589293368.png)
Dissipating Thermal Energy in PCBs – Atotech to participate in the IPC Automotive Electronics Reliability Forum || Electronics
The forum will be held from June 4 to 5, 2018, in Nuremberg, Germany.
![Alumseal® 611: New zincate for aluminum alloys designed to extend the electroless nickel process bath life || General metal finishing](https://www.atotech.com/wp-content/uploads/2018/05/Atotech_press_image_Alumseal_611-Preview.jpg)
Alumseal® 611: New zincate for aluminum alloys designed to extend the electroless nickel process bath life || General metal finishing
Alumseal® 611 has been developed by Atotech to provide very thin zinc coatings in order to reduce the amount of Zn contamination in the EN bath.
![Atotech Announces Anticipated Incremental Borrowings Under its Senior Secured Credit Facility and Private Offering of Senior PIK Toggle Notes by its Parent Company Alpha 2 B.V. || Corporate](https://www.atotech.com/wp-content/uploads/2018/05/Atotech-Announces-Anticipated-Incremental-Borrowings-prev.jpg)
Atotech Announces Anticipated Incremental Borrowings Under its Senior Secured Credit Facility and Private Offering of Senior PIK Toggle Notes by its Parent Company Alpha 2 B.V. || Corporate
Berlin, 17 May, 2018: Atotech B.V. (“Atotech”) announced today that its indirect parent company and the direct parent company of Alpha 3 B.V., Alpha 2 B.V. (the “Holdco Issuer”), intends to offer U.S. dollar-denominated, 5-year, senior unsecured PIK toggle notes in an...
![New products for advanced HDI and flex/ flex-rigid PCBs at C’Tex 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/05/InPro-THF-for-advanced-HDI-prev.jpg)
New products for advanced HDI and flex/ flex-rigid PCBs at C’Tex 2018 || Electronics
Atotech to present InPro® THF for advanced HDI and a series of new products for flex/ flex-rigid PCBs at C’Tex 2018.
![EcoTri® ONE: ONE passivate for zinc and zinc nickel || General metal finishing](https://www.atotech.com/wp-content/uploads/2018/05/EcoTri_ONE_on_zinc_nickel_small-e1525241821682.jpg)
EcoTri® ONE: ONE passivate for zinc and zinc nickel || General metal finishing
EcoTri® ONE is Atotech’s latest fluoride-free, iridescent thick film passivate. This all-in-one passivate is equally suitable for zinc or zinc nickel surfaces while giving excellent corrosion protection.
![BondFilm® HF – Atotech’s new horizontal bonding enhancement solution for high frequency applications || Electronics](https://www.atotech.com/wp-content/uploads/2018/04/BondFilmHF-prev.jpg)
BondFilm® HF – Atotech’s new horizontal bonding enhancement solution for high frequency applications || Electronics
BondFilm® HF is Atotech’s new process for the treatment of inner layer cores. It leads to highest bonding performance in the manufacture of multilayer & HDI printed circuit boards.
![Meeting the fastener world in Taiwan || General metal finishing](https://www.atotech.com/wp-content/uploads/2018/04/Fasteners_preview.png)
Meeting the fastener world in Taiwan || General metal finishing
Atotech, a global leader in the complex world of plating chemicals, equipment and services, presents next generation surface finishing technologies for fastener applications at the Taiwan International Fastener Show.
![Neoganth® W Pre Dip – Atotech’s new horizontal activator pre dip for fine line applications || Electronics](https://www.atotech.com/wp-content/uploads/2018/03/neoganth-w-predip-prev.jpg)
Neoganth® W Pre Dip – Atotech’s new horizontal activator pre dip for fine line applications || Electronics
Neoganth® W Pre Dip is Atotech’s new process for the desmear and metallization (PTH) process step for fine line HDI and package substrate applications. The new pre dip assures higher yield rates due to a significantly reduced occurrence of short circuits.
Tradeshows and events
![ECTC 2017 || Lake Buena Vista, FL, 美国](https://www.atotech.com/wp-content/uploads/2017/05/FO-PackageonPackage-prev.jpg)
ECTC 2017 || Lake Buena Vista, FL, 美国
安美特展示了FO-Panel Level Packaging (FO-PLP) 新一代电镀技术
![Hannover Fair || Hannover, Germany](https://www.atotech.com/wp-content/uploads/2017/04/hm_logo_col.jpg)
Hannover Fair || Hannover, Germany
Atotech will be participating in the world’s leading industrial fair, taking place in Hannover from April 24 – 28.
![2017 斯图加特紧固件展 || 德国 斯图加特](https://www.atotech.com/wp-content/uploads/2017/03/Fasteners-coating.jpg)
2017 斯图加特紧固件展 || 德国 斯图加特
于2017年3月28-30于德国 斯图加特的紧固件展, 3天的展期多达800个展商参展,安美特亦会展出最新的技术。
![2017表面处理展 || 墨西哥Santiago de Querétaro](https://www.atotech.com/wp-content/uploads/2016/03/GMF_blue.jpg)
2017表面处理展 || 墨西哥Santiago de Querétaro
安美特期待于2017年3月13-15日于墨西哥Santiago de Querétaro的表面处理展为大家带来最新的技术。
![Atotech to exhibit at SEMICON 2017 || Shanghai, China](https://www.atotech.com/wp-content/uploads/2017/02/Semicon_China_2017-prev.jpg)
Atotech to exhibit at SEMICON 2017 || Shanghai, China
Atotech will exhibit at Semicon China 2017 to be held in Shanghai from March 14 – 17, 2017.
![Fastener Fair Italy || Milan, Italy](https://www.atotech.com/wp-content/uploads/2016/02/Zinc-nickel-electrolytes.jpg)
Fastener Fair Italy || Milan, Italy
From September 28 – 29, we are presenting our most innovative and sustainable coating solutions at this year’s Fastener Fair in Milan, Italy.
![Semicon Europa 2016||Grenoble, France](https://www.atotech.com/wp-content/uploads/2016/08/semicon-europe-2015-preview.jpg)
Semicon Europa 2016||Grenoble, France
Senior leaders from Atotech’s semiconductor business division will be present at the show to discuss the latest additions to the portfolio, including the recent introduced MultiPlate.
![TPCA 2016||Taipei, Taiwan](https://www.atotech.com/wp-content/uploads/2016/08/tradefair.jpg)
TPCA 2016||Taipei, Taiwan
This October, Atotech will be showcasing its offerings at TPCA, one of the most important shows of the year in the field of circuit board development and applications.
![Semicon Taiwan 2016||Taipei, Taiwan](https://www.atotech.com/wp-content/uploads/2016/08/HKCPA.jpg)
Semicon Taiwan 2016||Taipei, Taiwan
Atotech will be participating at the upcoming SEMICON Taiwan 2016 – the premier event in Taiwan for microelectronics manufacturing.
![IPCA expo 2016 || New Delhi, India](https://www.atotech.com/wp-content/uploads/2016/08/IPCA-Expo-2016-india-preview.jpg)
IPCA expo 2016 || New Delhi, India
Atotech India will be showcasing its products at the IPCA Expo in New Delhi, India, from 18th through 20th of August this year.