News archive
Press releases
![Atotech at the ECTC conference in Las Vegas 2019 || Electronics](https://www.atotech.com/wp-content/uploads/2016/04/spherolyte-highlight-preview.jpg)
Atotech at the ECTC conference in Las Vegas 2019 || Electronics
Atotech will showcase its latest metallization products including the Spherolyte® product line for next generation RDL and pillar, the Xenolyte® product line for all electroless metallization needs, as well as its new MultiPlate® electrolytic deposition platform, designed as a flexible solution for both wafer and panel plating.
![Atotech wins distinction as a Top Employer 2019 in Germany || Corporate](https://www.atotech.com/wp-content/uploads/2019/03/top-employer-2019.jpg)
Atotech wins distinction as a Top Employer 2019 in Germany || Corporate
Atotech has once again earned a Top Employer award in Germany, which is awarded annually by the Top Employers Institute. In conferring the award, the institute again acknowledged and confirmed Atotech’s continuous focus of its people strategy.
![Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics](https://www.atotech.com/wp-content/uploads/2019/03/printoganth-t1-prev.jpg)
Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics
Atotech to present a new high-throw e’less Cu bath, through-hole, BMV filling, and conformal plating electrolyte, and its revolutionary ENIG final finish at the IPC APEX Expo 2019.
![A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics](https://www.atotech.com/wp-content/uploads/2019/03/nepcon-japan-teaser.jpg)
A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics
Atotech to present its new series of panel level plating processes and equipment for high resolution pattern plating during NEPCON Japan 2019.
![Atotech at the Electronics Packaging Technology Conference 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/11/SEM-micrographs-of-copper-structure-prev.jpg)
Atotech at the Electronics Packaging Technology Conference 2018 || Electronics
Atotech will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.
![Atotech to present at SEMICON Europa and electronica 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/11/Plating-fine-lines-Cu-pads-prev.jpg)
Atotech to present at SEMICON Europa and electronica 2018 || Electronics
Atotech’s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements.
![Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/10/Bridge_Plating_N-Inpulse2THF-prev.jpg)
Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018 || Electronics
Atotech will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook”.
![Atotech’s Surface Finish specialist Rick Nichols at this year’s SMTA International 2018 || Electronics](https://www.atotech.com/wp-content/uploads/2018/10/Rick-Nichols-at-SMTA-International-2018.jpg)
Atotech’s Surface Finish specialist Rick Nichols at this year’s SMTA International 2018 || Electronics
Atotech invites all conference visitors to join the talks and meet Rick Nichols to discuss these and other current product highlights.
![Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP) || Electronics](https://www.atotech.com/wp-content/uploads/2018/10/MultiPlate-PLP-prev.jpg)
Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP) || Electronics
Atotech specialists will speak at the iMAPS on several current topics such as recent developments and solutions for Panel-Level Packaging.
![The next revolution in electroless copper for advanced FPCB || Electronics](https://www.atotech.com/wp-content/uploads/2018/09/Printoganth-RA-prev-.jpg)
The next revolution in electroless copper for advanced FPCB || Electronics
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.
Tradeshows and events
![Atotech to present at the 17th International Conference on Device Packaging 2021 || Electronics](https://www.atotech.com/wp-content/uploads/2021/03/imaps-logo.png)
Atotech to present at the 17th International Conference on Device Packaging 2021 || Electronics
Berlin, April 1, 2021 – Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for printed circuit boards, IC substrates, lead frames, connectors and semiconductor advanced packaging, is pleased to announce its participation...
![Atotech experts to participate in this year’s IPC APEX EXPO 2021 || Electronics](https://www.atotech.com/wp-content/uploads/2021/03/IPC-APEX-Expo-2021-e1614776217977.png)
Atotech experts to participate in this year’s IPC APEX EXPO 2021 || Electronics
Berlin, March 6, 2021 - Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others,...
![Atotech to participate in the 15th Electronic Circuits World Convention (ECWC) || Electronics](https://www.atotech.com/wp-content/uploads/2020/11/ecwc_logo_square-828x675.jpg)
Atotech to participate in the 15th Electronic Circuits World Convention (ECWC) || Electronics
Berlin, November 23, 2020 - Atotech, a global leader in the field of specialty chemicals and equipment for printed circuit board, package substrate, and semiconductor manufacturing will participate in the upcoming ECWC, which will be hosted by the Hong Kong Printed...
![Atotech to participate in IMPACT-EMAP 2020 Conference and TPCA Show 2020 || Electronics](https://www.atotech.com/wp-content/uploads/2020/10/logo-preview.png)
Atotech to participate in IMPACT-EMAP 2020 Conference and TPCA Show 2020 || Electronics
Berlin, October 19, 2020 Atotech, a global leader in the field of specialty chemicals and equipment for printed circuit board, package substrate, and semiconductor manufacturing will participate in the upcoming IMPACT-EMAP 2020 Conference, which will be held in...
![Atotech to present at the 17th International Wafer-Level Packaging Conference 2020 || Electronics](https://www.atotech.com/wp-content/uploads/2020/10/IWLPC-Logo-Square-e1601980602434.jpg)
Atotech to present at the 17th International Wafer-Level Packaging Conference 2020 || Electronics
Berlin, October 9, 2020 - Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, will present at this year’s IWLPC. The on-demand conference and expo...
![Atotech to present at the SMTA International 2020 || Electronics](https://www.atotech.com/wp-content/uploads/2020/09/SMTA-Square-e1600258612554.jpg)
Atotech to present at the SMTA International 2020 || Electronics
Berlin, September 16, 2020 - Atotech, a global supplier of specialty chemicals, equipment, and service, is pleased to announce its participation in the upcoming SMTA International. The on-demand conference and virtual exhibition will be held from September 28 through...
![Atotech to participate in SEMICON Taiwan 2020 || Electronics](https://www.atotech.com/wp-content/uploads/2020/09/semicon-taiwan-logo-square.png)
Atotech to participate in SEMICON Taiwan 2020 || Electronics
Atotech will participate in this year’s SEMICON Taiwan. Meet our experts at booth K2276 and join our technical session at the SiP Global Summit 2020 – Day 1!
![Atotech to participate in SEMICON China and CSTIC 2020 || Electronics](https://www.atotech.com/wp-content/uploads/2020/06/Semicon-china-CSTIC-website-foto-e1592543614422.png)
Atotech to participate in SEMICON China and CSTIC 2020 || Electronics
Atotech will participate in SEMICON China at the Shanghai New International Expo Center from June 27 – 29. Join us at booth E5317!
![Atotech to present at the ECTC virtual conference 2020 || Electronics](https://www.atotech.com/wp-content/uploads/2020/05/ECTC-2020-Logo-e1590144164722.gif)
Atotech to present at the ECTC virtual conference 2020 || Electronics
Atotech will participate in this year´s ECTC. Join us in this virtual conference!
![Meet us at SFChina 2019](https://www.atotech.com/wp-content/uploads/2019/11/SF-China-2019-Teaser.png)
Meet us at SFChina 2019
Atotech will present at the largest trade show for both the Chinese and Asian finishing markets: SFChina 2019. Join us at booth E1. B05!