Aurotech® G-Bond 3
New mixed reaction gold for ENIG, ENEPIG and EPAG
Non-toxic stabilizer
no handling of KCN
Low gold content
of 0.6 g/l
High bath stability
and long lifetime
Aurotech® G-Bond 3 is the latest generation gold electrolyte that fulfills all industry standards for ENIG, ENEPIG, and EPAG plating. It exhibits autocatalytic plating properties to mitigate the attack to the underlying layer and enables the plating of high gold thickness where required.
Besides offering the highest bath stability and excellent layer performance, the process exhibits the benefit of non-toxic stabilization so that no handling of KCN replenishment is required. The new process combines the known benefits of Aurotech® G-Bond 2 with outstanding stability, long bath life, and a new and toxic-free stabilizer.
- Versatile gold plating electrolyte to deposit ENIG, ENEPIG, ENEPAG and EPAG layers.
- Mixed reaction gold electrolyte with autocatalytic properties for mitigated corrosive attack and optimized thickness distribution
- Non-toxic stabilization for safe handling and excellent bath stability
- Low gold content for reduced precious metal cost
What inspires us
Why we developed Aurotech® G-Bond 3
Your challenge
For corrosion-free ENIG layers or for higher gold thickness deposits in ENEPIG gold electrolytes with autocatalytic properties are the preferred solution. These types of gold typically require additional stabilization based on KCN which leads to increased risk for the worker and the environment.
Our solution
To tackle this issue we have developed Aurotech® G-Bond 3, a gold electrolyte offering autocatalytic plating properties without the need for additional KCN stabilization. Due to its unique composition, Aurotech® G-Bond 3 enables versatile use for plating Ni/Au, Ni/Pd/Au, and Pd/Au deposits without needing any adjustments on the plating solution. The bath provides excellent stability and a long lifetime and allows the deposition of a high gold layer thickness on nickel and palladium. In addition, the autocatalytic dominated reaction mitigates the risk of a corrosive attack on nickel so that the latest industry standards on the corrosive attack in ENIG can be easily fulfilled. The low gold content and the excellent thickness distribution allow for keeping the gold plating cost low by reducing the drag-out losses and allowing low target layer thickness. A dosing master for automated replenishment is available to further automate process operation. It also further reduces tank cleaning and therewith needed maintenance.