Spherolyte® NiFe
All-liquid ECD NiFe electrolyte for barrier plating and electromagnetic shielding
Outstanding diffusion barrier properties
Ultra-thin, uniform IMC layer formation
Robust
process
Wide operating window
Effective magnetic shielding
Due to adjustable iron content
All-liquid NiFe plating process for next-generation barrier plating and electromagnetic shielding.
Spherolyte Ni is an all-liquid electrolyte used for a wide range of barrier functions. Through the deposition of nickel-iron alloys, this process enables strong magnetic shielding to counteract electromagnetic interference. In addition, NiFe allows the deposition of thinner barrier layers between Cu bumps and solder materials due to its enhanced diffusion barrier properties compared to standard Ni deposits. As a result, NiFe can contribute to increased miniaturisation and improved performance of next generation semiconductor devices.
What inspires us
Why we developed Spherolyte NiFe
Your challenge
Advanced packaging technologies have emerged as an enabler of further miniaturisation and increased performance. The increasing demand for higher performance is driving the need for smaller semiconductor devices. This miniaturisation trend requires smaller vertical interconnect bumps and therefore next generation processes that enable the deposition of smaller bumps. Improved barrier layers are required to prevent diffusion of the Cu bump material into the solder material and vice versa.
Our solution
Spherolyte NiFe allows the deposition of a nickel-iron alloy with improved IMC formation properties. This allows the deposition of thinner barrier layers and improved barrier properties. The process is based on our standard sulphamic acid based Spherolyte Ni process and the use of two additional additives which allow the iron content to be adjusted as required.