Xenolyte® Au
Electroless gold plating
Xenolyte® Au C
Cyanide-based, highly stable immersion Au process
Xenolyte® Au CF 2
Cyanide-free immersion Au process
Xenolyte® Au TG
Cyanide-, EDTA-, formaldehyde-free autocatalytic thick Au process
Xenolyte® Au C – immersion, cyanide-based gold
MKS’ Atotech’s Xenolyte® Au C process is a stable immersion, cyanide-based gold bath for highly reliable Au depositions up to 50 nm. The process is proven and qualified for automotive applications and MEMS. They can be used in single wafer as well as wet bench tools and hence allow cost-efficient manufacturing.
Xenolyte® Au CF 2 – immersion, cyanide-free gold
MKS’ Atotech’s Xenolyte® Au CF 2 process is a cyanide-free gold bath for highly reliable Au deposition up to 50 nm. Xenolyte® Au CF 2 is tailored towards lowest Ni corrosions. The process is proven and qualified for automotive applications and MEMS. They can be used in single wafer as well as wet bench.
Xenolyte® Au TG – autocatalytic, sustainable thick gold
MKS’ Atotech’s Xenolyte® Au TG is our autocatalytic process, which was developed for the deposition of thick gold layers and allows the corrosion-free deposition of Au on Ni and Ni/Pd of up to 250 nm. Xenolyte® Au TG is cyanide-, EDTA- and formaldehyde-free and doesn’t require an immersion Au pre-strike step.
What inspires us
Why we developed Xenolyte® Au solutions
Your challenge
For under bump metallization in semiconductor devices, electroless Ni/immersion Au (ENIG) or electroless Ni/electroless Pd/ immersion Au (ENEPIG) processes are employed as standard final finish prior to wire bonding and solder application. Metal pads – in particular nickel, palladium, gold – are needed to ensure optimal contact to provide highest reliability in following wire bonding processes.
Our solution
Xenolyte® Au processes are designed to meet the requirements to the fullest. The process shows excellent conductivity and wire bonding as well as soldering properties. Depending on the application, we offer cyanide-based and cyanide-free immersion gold processes as well as an autocatalytic process for thick gold deposition. They fulfill international automotive and MEMS standards and requirements. The process can be used in single wafer as well as wet bench tools.