Xenolyte® Ni
Electroless Ni for all requirements
Xenolyte® Ni TR
Ni-alloy for high temperature applications
Xenolyte® Ni RE
Ni for low-temperature plating
Xenolyte® Ni LF
Sustainable, lead-free Ni with low tensile stress
Xenolyte Ni TR – our product of choice for low-stress, high temperature tolerant Ni deposition layers. The nickel deposits withstand high temperature budgets of up to 450 °C during chip processing.
The chemistry is optimized for the Xenolyte® processes for ENEP(IG). The Xenolyte® portfolio includes cleaning and activation pre-treatment solutions and plating chemistries for the electroless deposition of nickel, palladium, and gold on Cu and Al alloys. It enables hard, corrosion-free, and stress-minimized metal stacks to protect underlying active structures and provide a robust, stable, and low-resistance solder joint connection to the IC substrate.
Xenolyte Ni RE – our product of choice for low temperature plating, especially designed for RDL housing applications. A thin Ni diffusion layer is deposited to protect fine Cu RDL lines against Cu migration into PI and Cu oxide formation during PI curing.
The chemistry is optimized for the Xenolyte® processes for ENEP(IG). The Xenolyte® portfolio includes cleaning and activation pre-treatment solutions and plating chemistries for the electroless deposition of nickel, palladium, and gold on Cu and Al alloys. It enables hard, corrosion-free, and stress-minimized metal stacks to protect underlying active structures and provide a robust, stable, and low-resistance solder joint connection to the IC substrate.
Xenolyte Ni LF – our product of choice for a lead-free Ni plating. It shows excellent plating results and low tensile strengths of the deposits without the use of commonly contained lead.
The chemistry is optimized for the Xenolyte® processes for ENEP(IG). The Xenolyte® portfolio includes cleaning and activation pre-treatment solutions and plating chemistries for the electroless deposition of nickel, palladium, and gold on Cu and Al alloys. It enables hard, corrosion-free, and stress-minimized metal stacks to protect underlying active structures and provide a robust, stable, and low-resistance solder joint connection to the IC substrate.
What inspires us
Why we developed Xenolyte® Ni solutions
Your challenge
For under bump metallization in semiconductor devices, electroless Ni/immersion Au (ENIG) or electroless Ni/electroless Pd/ immersion Au (ENEPIG) processes are employed as standard final finish prior to wire bonding and solder application. Metal pads – nickel, palladium, gold – are needed to ensure optimal contact to provide highest reliability in following wire bonding processes.
Our solution
We offer a variety of Xenolyte® Ni processes which are commonly used for Ni plating in ENEPIG (Ni/Pd/Au), ENIG (Ni/Au) and ENEP (Ni/Pd) deposition. This includes processes and products for cleaning and activation pre-treatment solutions, as well as plating chemistries for the electroless deposition of nickel, palladium, and gold on Cu, Al and directly on semiconductors.