Xenolyte® Pd HS
Pure electroless Pd plating
High
reliability
Pure palladium deposits for best reliability performance
High process stability
Stable deposition rate over the entire extended bath lifetime
Automotive qualified
High volume manufacturing proven
Xenolyte® Pd HS in ENEPIG and ENEP
Xenolyte Pd HS is our autocatalytic Pd process for the deposition of pure Pd layers and perfectly addresses the requirements of the automotive and power semiconductor industries.
Xenolyte® Pd HS allows plating of pure Pd deposits. Common processes for electroless plating of Pd lead to the co-deposition of phosphorous. This leads to amorphous PdP deposits with smaller ductility and stronger tensile stress than for pure, crystalline Pd deposits. Impurities (e.g., P) may additionally lead to segregations and hence impact the properties of the deposits such as conductivity and reliability.
What inspires us
Why we developed Xenolyte® Pd HS
Your challenge
For under bump metallization in semiconductor devices, electroless Ni/immersion Au (ENIG) and electroless Ni/electroless Pd/ immersion Au (ENEPIG) processes are employed as standard final finish prior to wire bonding and solder application. Metal pads – nickel, palladium, gold – are needed to ensure optimal contact to provide highest reliability in following wire bonding processes.
Our solution
We offer an autocatalytic palladium process for the deposition of pure palladium. Xenolyte® Pd HS provides the perfect surface finish for under-bump metallization (UBM) and is a qualified and high-volume manufacturing proven for automotive and MEMS applications. Compared to conventional PdP processes, our pure palladium deposit is stronger and more reliable due to higher ductility and less tensile stress as it forms pure crystalline structures.