NovaBond® PX-S2
Electronics
Ultra low roughness adhesion promoter for high-speed signal transmission
Maintaining line width and low roughness
Uses a unique hybrid bonding technique that enables the precise control of nano-roughening and chemical bonding
Adhesion
promoter
Achieves optimal bonding by combining mechanical interlocking and interfacial chemical bonding
Ultra-low
signal loss
Characterized by significantly reduced attenuation, through low roughness
NovaBond® PX-S2
The process combines the advantages of nano-roughening through a unique selective etching technique with the benefits of chemical adhesion promoter solutions. This innovative process ensures that the trace geometry and line-width remain unaltered, preserving the integrity of the conductor design. As a result, the signal integrity (SI) performance is comparable to that of a conductor without roughening, making it ideal for high-frequency applications. Additionally, NovaBond PX-S2 guarantees excellent thermal reliability and superior bonding strength, providing a robust and reliable solution for advanced PCB manufacturing needs.
NovaBond PX-S2 is the optimal solution for high-frequency and/or fine L/S applications, such as communication, AI, smartphones, and other applications where optimal signal transmission is key. It offers the benefits of non-roughening adhesion without its downside. Up until 32 GHz, no significant difference in signal integrity could be measured.
- Uniform and constant nano-roughening regardless of copper surface type
- High compatibility to various high-speed materials
- Minimum relative surface area increase
- Very suitable for PCB manufacturing with ultra low loss demand
- Signal integrity like non-treated; 10% better than conventional adhesion enhancement processes (at 32GHz)
- Great adhesion and excellent thermal reliability
What inspires us
Why we developed NovaBond® PX-S2
Your challenge
The increasing complexity of high-speed electronic devices necessitates advanced bonding techniques that can ensure signal integrity, thermal reliability, and robust bonding strength without compromising the delicate geometries of modern PCBs. Traditional methods of surface treatment, which often involve substantial roughening, can degrade signal integrity and alter the precise trace geometries required for advanced electronics. This presents a significant challenge for manufacturers striving to meet the stringent demands of high-speed signal transmission and intricate PCB designs.
Our solution
NovaBond® PX-S2 addresses this challenge by combining nano-roughening through a unique selective etching technique with the advantages of chemical adhesion promoter solutions. This innovative process preserves the trace geometry and line-width, ensuring that the signal integrity remains comparable to that of a conductor without roughening. By creating ultra-fine nano-cavities, NovaBond PX-S2 achieves superior molecular-level bonding without significant roughness, thus maintaining high signal performance and thermal reliability. Additionally, the process supports minimal signal loss, making it ideal for applications demanding high-speed signal transmission and intricate, reliable bonding.